Multilayer PCBA Circuit Board Assembly PCB SMT with DIP Technology One-Stop PCBA

Product Details
Customization: Available
Type: Combining Rigid Circuit Board
Dielectric: FR-4
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  • Multilayer PCBA Circuit Board Assembly PCB SMT with DIP Technology One-Stop PCBA
  • Multilayer PCBA Circuit Board Assembly PCB SMT with DIP Technology One-Stop PCBA
  • Multilayer PCBA Circuit Board Assembly PCB SMT with DIP Technology One-Stop PCBA
  • Multilayer PCBA Circuit Board Assembly PCB SMT with DIP Technology One-Stop PCBA
  • Multilayer PCBA Circuit Board Assembly PCB SMT with DIP Technology One-Stop PCBA
  • Multilayer PCBA Circuit Board Assembly PCB SMT with DIP Technology One-Stop PCBA
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  • Overview
  • FAQ
Overview

Basic Info.

Model NO.
PCBA
Material
Fiberglass Epoxy
Application
Consumer Electronics
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Fr4
Brand
Jhft
Min. Hole Size
0.15mm
Min. Line Spacing
0.075---0.09mm
Surface Finishes
HASL Lead-Free, Enig, Enepig, Gold Fingers, OSP, I
Layer Count
1-40
Transport Package
Vacuum Package
Specification
35cm*25cm*27cm
Trademark
JHFT
Origin
China
HS Code
8504409902
Production Capacity
3000 Square Meters/Month

Product Description

Multilayer PCBA Circuit Board Assembly SMT with DIP Technology One-Stop PCBA
Multilayer PCBA Circuit Board Assembly PCB SMT with DIP Technology One-Stop PCBA


PCB Parameters
Item PCB Parameters
Material FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core,  etc
Material Brands KB, ITEQ, SY, ISOLA, etc
Layer Count 1-40
Flammaility UL 94V-0
Thermal Conductivity 0.3W-300W/mk
Quality Standards IPC Classes 2/3
HDI Build-up Any Layer, up to 3+N+3
Board Thickness 0.2~7mm
Min Thickness 2-layer: 0.2mm
4-layer: 0.4mm
6-layer: 0.6mm
8-layer: 0.8mm
10-layer: 1mm
More than 10 layers: 0.5*Layer Count*0.2mm
Copper Thickness 0.5-20oz
Inks Super White Inks/Solar/Carbon Inks
Solder Mask Thickness 0.2mil-1.6mil
Surface Finishes Bare Copper, Hasl lead-free, ENIG, ENEPIG, Gold Fingers, OSP, IAg, ISn, etc
Plating Thickness HASL:
Copper Thickness: 20-35um Tin: 5-20 um
Immersion Gold:
Nickel: 100u"-200u" Gold: 2u" -4u"
Hard Plated Gold:
Nickel: 100u"-200u" Gold: 4u"-8u"
Golden Finger:
Nickel: 100u"-200u" Gold: 5u"-15u"
Immersion Silver: 6u"-12u"
OSP: Film 8u"-20u"
Min Hole Size 0.15mm
Min Trace Width/Spacing 2mil/2mil
Via Plugging 0.2~0.8mm
Line Width/Space Tolerance ±10%
Board Thickness Tolerance ±5%
Hole Diameter Tolerance ±0.05mm
Hole Location Tolerance ±2mil
Layer to Layer Registration 2mil
S/M Registration 1mil
Aspect Ratio 10:01
Blind Vias Aspect Ratio 1:01
Outline Tolerance ±0.1mm
V- CUT Tolerance ±10mi
Bevel Edge ± 5mil
Warp and Twist ≤0.50% (max cap)
Quality Test AOI, 100% E-test
Value-Added Services DFM Check,  Expedited Production
Featured Processes Bonding, Impedance Control, Via in Pad, Press Fit Hole, Countersink/Counterbore Hole, Castellated Vias, Edge Plating, Peelable Solder Mask, Resin Plugged, Plating Flat
Data Formats Gerber, DXF, ODB++, HPGL, BRD, etc
Multilayer PCBA Circuit Board Assembly PCB SMT with DIP Technology One-Stop PCBA
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FAQ

Q1: Are you a Manufacturer or a Trading Company?
A: We are the primary factory for PCB & PCBA in Shenzhen. You are welcome to visit us in person for inspection.

Q2: What about the MOQ?
A: No MOQ.

Q3: How can I get the accurate price?
A: Please provide us with the Gerber files for your product, or inform us about the product dimensions, layer count, and other relevant information.

Q4: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 2 hours for PCB quotation and around 24 hours for PCBA quotation.

Q5:Can we inspect quality during production?
A: Yes, we are open and transparent on each production process with nothing to hide. We welcome customer inspect our production process and check inhouse.


 

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