| Customization: | Available |
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| Metal Coating: | Gold |
| Mode of Production: | SMT |
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PCB capability
| Layer count | 1-40 layers |
| Material | fr4,Tg,cem-3,cem-1,etc. |
| Copper thickness | 1/2oz,1oz,2oz,etc. |
| Board thickness | 0.2-6.0mm |
| Min.line width/space | 3/3 mil(75/75um) |
| Min. drill size | 8 mil(0.2mm) |
| Min. HDI laser drill size | 3 mil(0.067mm) |
| Tolerance of hole size | 2 mil(0.05mm) |
| PTH copper thickness | 1 mil(25 um) |
| Solder mask color | Green,blue,yellow,white,black,red,etc. |
| Peelable solder mask | yes |
| surface treating | HASL(ROHS), ENIG,OSP,gold finger,etc, |
| Gold thickness | 2-30u" (0.05-0.76um) |
| One-stop PCBA | PCB+components sourcing+assembly+test+package | ||
| SMT capability | 1,000,000 points per day | ||
| DIP capability | 200,000 points per day | ||
| Experiences | QFP, BGA, μBGA, CBGA | ||
| Process | Lead-free | ||
| Components details | BGA and VFBGA | ||
| Leadless Chip Carriers/CSP | |||
| Double-sided SMT Assembly | |||
| Fine Pitch to 0.8mils | |||
| BGA Repair and Reball | |||
| Part Removal and Replacement | |||
| PCB assembly process | Drilling---Exposure---Plating---Etaching & Stripping---Punching---Electrical Testing---SMT---Wave Soldering---AOI test---Assembling---ICT---Function Testing--Temperature & Humidity&Aging ect. Testing | ||
| Items | FPC board |
| Material | Flex |
| Layers | 1-10L |
| Max cut lamination size | 500*400mm |
| Final board thickness | (2L)0.07mm-0.2mm |
| Min Final Hole size | 0.075mm |
| Aspect Ratio | - |
| Inner layer Line Width/Space | 0.03mm |
| Copper Foil Thickness (Inner Layers) | 1/6oz-1oz |
| Min dielectric layer thickness | 20um |
| Copper Foil Thickness (Outer Layers) | 1/3oz-1oz |
| Copper to drill distance | 0.2mm |
| Out layer Line width/space | 0.035mm |
| Min SMD width | 0.05mm |
| Max Solder Mask Plug Hole Diameter | - |
| solder mask strip width | 0.075mm(Green/1OZ) |
| Final Set Size Tolerance | ±0.1mm/limit±0.05mm |
| Min Hole to board edge Distance | 0.075-0.15mm |
| Min Beveling angle Tolerance | - |
| Layer to layer Tolerance | ≤0.075mm(1-6L) |
| Inner layer Min PTH Annular Ring | 0.15mm |
| Out layer Min PTH Annular ring | 0.15mm |
| Surface Treatment | OSP,ENIG,Gold Finger,Plating Gold ,IMM TIN,IMM AG |
| Warp&Twist | Reinforced part according to customer request |
FAQ:
Q1:What kind of PCB file format can you accept for production?
A:Gerber, PROTEL 99SE, PROTEL DXP, CAM350, ODB+(.TGZ)
For PCBA project, please send us your Gerber files, BOM(bill of material),and pcb specification.
For plastic enclosure/junction box/shell, please send us your 3D drawing,and material.
For ODM/Engineer Development service, please consult our sales engineer for more details.
Q2:Is my PCB files safe when I submit them to you for manufacturing?
We respect customer's copyright and will never manufacture PCB for someone else with your files unless we receive written permission from you, nor we'll share these files with any other 3rd parties.NDA agreement is workable.
Q3: Can you also handle PCB Assembly?
We have our own PCB assembly factory which can help to source all the components for your product according to your BOM .
Q4: Can you provide ODM and OEM service?
We have experienced R&D team which can do research and design as your requests. Also we good at do reverse engineering .
Q5:What payments do you accept ?
-Wire Transfer(T/T),Western Union,Letter of Credit(L/C),Paypal ,Ali Pay,Credit Cart
Q6:How to ship the goods?
A:For small packages, we will ship the boards to you by DHL,UPS,FedEx,EMS. Door to door service! You will get your PCBs at your home.
B:For heavy goods more than 300kg, we may ship your boards by ship or by air to save freight cost. Of course, if you have your own forwarder,we may contact them for dealing with your shipment.
Q7:What is your minimum order quantity?
No MOQ limitation
Q8: Can we visit your company?
No problem. You are welcome to visit us in Shenzhen. Or the other factory is in GuangDong province.
Q9: How can you ensure the quality of the PCBs?
Our PCBs and PCBA productions are 100% test including Flying Probe Test, E-test and AOI and functional test.
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