| Customization: | Available |
|---|---|
| Metal Coating: | Copper, Gold |
| Mode of Production: | SMT, SMT |
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PCBA Products
PCB capability
| Layer count | 1-40 layers |
| Material | fr4,Tg,cem-3,cem-1,etc. |
| Copper thickness | 1/2oz,1oz,2oz,etc. |
| Board thickness | 0.2-6.0mm |
| Min.line width/space | 3/3 mil(75/75um) |
| Min. drill size | 8 mil(0.2mm) |
| Min. HDI laser drill size | 3 mil(0.067mm) |
| Tolerance of hole size | 2 mil(0.05mm) |
| PTH copper thickness | 1 mil(25 um) |
| Solder mask color | Green,blue,yellow,white,black,red,etc. |
| Peelable solder mask | yes |
| surface treating | HASL(ROHS), ENIG,OSP,gold finger,etc, |
| Gold thickness | 2-30u" (0.05-0.76um) |
| One-stop PCBA | PCB+components sourcing+assembly+test+package | ||
| SMT capability | 1,000,000 points per day | ||
| DIP capability | 200,000 points per day | ||
| Experiences | QFP, BGA, μBGA, CBGA | ||
| Process | Lead-free | ||
| Components details | BGA and VFBGA | ||
| Leadless Chip Carriers/CSP | |||
| Double-sided SMT Assembly | |||
| Fine Pitch to 0.8mils | |||
| BGA Repair and Reball | |||
| Part Removal and Replacement | |||
| PCB assembly process | Drilling---Exposure---Plating---Etaching & Stripping---Punching---Electrical Testing---SMT---Wave Soldering---AOI test---Assembling---ICT---Function Testing--Temperature & Humidity&Aging ect. Testing | ||
| Items | FPC board |
| Material | Flex |
| Layers | 1-10L |
| Max cut lamination size | 500*400mm |
| Final board thickness | (2L)0.07mm-0.2mm |
| Min Final Hole size | 0.075mm |
| Aspect Ratio | - |
| Inner layer Line Width/Space | 0.03mm |
| Copper Foil Thickness (Inner Layers) | 1/6oz-1oz |
| Min dielectric layer thickness | 20um |
| Copper Foil Thickness (Outer Layers) | 1/3oz-1oz |
| Copper to drill distance | 0.2mm |
| Out layer Line width/space | 0.035mm |
| Min SMD width | 0.05mm |
| Max Solder Mask Plug Hole Diameter | - |
| solder mask strip width | 0.075mm(Green/1OZ) |
| Final Set Size Tolerance | ±0.1mm/limit±0.05mm |
| Min Hole to board edge Distance | 0.075-0.15mm |
| Min Beveling angle Tolerance | - |
| Layer to layer Tolerance | ≤0.075mm(1-6L) |
| Inner layer Min PTH Annular Ring | 0.15mm |
| Out layer Min PTH Annular ring | 0.15mm |
| Surface Treatment | OSP,ENIG,Gold Finger,Plating Gold ,IMM TIN,IMM AG |
| Warp&Twist | Reinforced part according to customer request |
Q: What type of services do you provide ?
PCBasic: We provide turnkey solutions including PCB fabrication, components sourcing, SMT/DIP assembly, testing, mold injection, and other value-added servics.e
Q: What is required for PCB & PCBA quotation?
PCBasic:
1. For PCB: QTY, Gerber filesand technical requirements(material, size, surface finish treatment, copper thickness, board thickness etc).
2. For PCBA: PCB information, BOM list, Testing documents.
Q: What is your minimum order quantity (MOQ)?
PCBasic: No MOQ limited, sample and mass production both support.
Q:Do you keep the provider product information and design files confidential?
PCBasic: We are willing to sign a NDA effect by customers side local law and promising to keep customers data in high confidential level.
Q: Do you accept process materials supplied by clients?
PCBasic: Yes, we can provide component source, and also accept component from client.
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