SMT Electronics PCBA OEM Design PCBA and PCB Assembly PCB Design

• Customization: Available
• Type: Rigid Circuit Board, Rigid Circuit Board
• Dielectric: FR-4, Fr-4
• Model NO.: 50381
• Material: Fiberglass Epoxy Resin + Polyimide Resin, Fiberglass Epoxy
• Application: Consumer Electronics, Medical Instruments
• Flame Retardant Properties: V0, V0
• Mechanical Rigid: Rigid, Rigid
• Processing Technology: Electrolytic Foil, Electrolytic Foil
• Base Material: Aluminum, Aluminum
• Insulation Materials: Epoxy Resin, Epoxy Resin
• Brand: Jhwl
• Surface Finish: HASL, Enig, OSP
• Surface Treating: HASL(RoHS), Ening, OSP, Immersion Silver, Immersion T
• Min.Line Width/Space: 3/3 Mil(75/75um)
• Gold Thickness: 2-30u" (0.05-0.76um)
• Transport Package: OEM
• Specification: 35*25*27
• Trademark: JHWL
• Origin: China

Product Description

PCB capability

Layer count	1-40 layers
Material	fr4,Tg,cem-3,cem-1,etc.
Copper thickness	1/2oz,1oz,2oz,etc.
Board thickness	0.2-6.0mm
Min.line width/space	3/3 mil(75/75um)
Min. drill size	8 mil(0.2mm)
Min. HDI laser drill size	3 mil(0.067mm)
Tolerance of hole size	2 mil(0.05mm)
PTH copper thickness	1 mil(25 um)
Solder mask color	Green,blue,yellow,white,black,red,etc.
Peelable solder mask	yes
surface treating	HASL(ROHS), ENIG,OSP,gold finger,etc,
Gold thickness	2-30u" (0.05-0.76um)

PCBA capability

One-stop PCBA	PCB+components sourcing+assembly+test+package
SMT capability	1,000,000 points per day
DIP capability	200,000 points per day
Experiences	QFP, BGA, μBGA, CBGA
Process	Lead-free
Components details	BGA and VFBGA
	Leadless Chip Carriers/CSP
	Double-sided SMT Assembly
	Fine Pitch to 0.8mils
	BGA Repair and Reball
	Part Removal and Replacement
PCB assembly process	Drilling---Exposure---Plating---Etaching & Stripping---Punching---Electrical Testing---SMT---Wave Soldering---AOI test---Assembling---ICT---Function Testing--Temperature & Humidity&Aging ect. Testing

FCB capability
 

Items	FPC board
Material	Flex
Layers	1-10L
Max cut lamination size	500*400mm
Final board thickness	(2L)0.07mm-0.2mm
Min Final Hole size	0.075mm
Aspect Ratio	-
Inner layer Line Width/Space	0.03mm
Copper Foil Thickness (Inner Layers)	1/6oz-1oz
Min dielectric layer thickness	20um
Copper Foil Thickness (Outer Layers)	1/3oz-1oz
Copper to drill distance	0.2mm
Out layer Line width/space	0.035mm
Min SMD width	0.05mm
Max Solder Mask Plug Hole Diameter	-
solder mask strip width	0.075mm(Green/1OZ)
Final Set Size Tolerance	±0.1mm/limit±0.05mm
Min Hole to  board edge Distance	0.075-0.15mm
Min Beveling angle Tolerance	-
Layer to layer Tolerance	≤0.075mm(1-6L)
Inner layer Min PTH Annular Ring	0.15mm
Out layer Min PTH Annular ring	0.15mm
Surface Treatment	OSP,ENIG,Gold Finger,Plating Gold ,IMM TIN,IMM AG
Warp&Twist	Reinforced part according to customer request

Company Profile

Detailed Photos

 

 

Packaging & Shipping

Certifications

 

FAQ

Q. What is your best pricQ.What kind of documents/files do you need for quotation?

For PCBA project, please send us your Gerber files, BOM(bill of material),and pcb specification.
For plastic enclosure/junction box/shell, please send us your 3D drawing,and material.
For ODM/Engineer Development service, please consult our sales engineer for more details.

Q. How to keep our product information and design file secret ?
We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

Q.How long does it take for PCB and PCBA Quote ?
*Please note that the following detail will speed up evaluation:
Material:
Board thickness:
Copper thickness:Surface finish:
Solder mask color:
Silkscreen color:

 

Q.How can we guarantee you receive an good quality product?
For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.